What is the difference between cob light source and smd _ difference between cob light source and smd light source

In everyone's cognition, we must know the SMD light source. In fact, the COB light source we are talking about is an upgraded version of the SMD light source. Then you will definitely ask which upgrades are made. The following small series will tell you what is the cob light source, SMD. The difference between a light source and a COB source.

The COB light source means that the chip is directly packaged on the entire substrate, that is, the N chips are successively integrated and packaged on the inner substrate. It is mainly used to solve the problem of low-power chip manufacturing high-power LED lamp, which can disperse the chip heat dissipation, improve the light efficiency, and improve the glare effect of the LED lamp. The COB luminous flux density is high, and the glare is less soft and emits a uniform light surface.

The COB light source is a high-efficiency integrated surface light source technology in which the LED chip is directly attached to a high-reflection mirror metal substrate. This technology eliminates the bracket concept, electroless plating, no reflow soldering, and no patching process, so the process is reduced by nearly three points. One of them, the cost is also saved by one third.

The COB light source can be simply understood as a high-power integrated surface light source, and the light-emitting area and external dimensions of the light source can be designed according to the product outline structure.

Electrically stable, circuit design, optical design, heat dissipation design is scientific and reasonable;

The use of heat sink process technology ensures that the LED has an industry-leading heat lumen maintenance rate (95%).

It is convenient for secondary optical matching of products and improves lighting quality.

High color, uniform light, no spot, healthy and environmentally friendly.

The installation is simple, the use is convenient, the design difficulty of the lamp is reduced, and the processing of the lamp and the subsequent maintenance cost are saved.

SMD LEDs are the meaning of surface mount LEDs, which help increase productivity and different facility applications. It is a solid-state semiconductor device that converts electricity directly into light. Its voltage is 1.9-3.2V, the red and yellow voltage are the lowest. The heart of the LED is a semiconductor wafer. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the whole wafer is Epoxy resin is encapsulated. The semiconductor wafer consists of two parts, one part is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a PN junction. When a current is applied to the wafer through the wire, the electrons are pushed toward the P region. In the P region, electrons recombine with the holes, and then the energy is emitted in the form of photons. This is the principle of LED illumination. The wavelength of light, which is the color of light, is determined by the material that forms the PN junction.

The traditional LED: "LED light source discrete device → MCPCB light source module → LED lamp", mainly because there is no suitable core light source components, it is not only time-consuming, but also costly.

The COB package "COB light source module → LED lamp" can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, saving LED one-time packaging cost, light engine module manufacturing cost and secondary light distribution cost. . In terms of performance, through reasonable design and microlens molding, COB light source module can effectively avoid the disadvantages such as spot light and glare in the combination of discrete light source devices; it can also reduce the light source efficiency by adding appropriate red chip combination. Under the premise of life, the color rendering of the light source is effectively improved.

The COB package is basically the same in the production process as the traditional SMD production process. In the solid crystal, the wire bonding process and the SMD package efficiency are basically the same, but in the dispensing, separation, spectroscopic, packaging, the efficiency of the COB package is better than the SMD class. The product is much higher. The traditional SMD package labor and manufacturing costs account for about 15% of the material cost. The COB package labor and manufacturing costs account for about 10% of the material cost. With COB packaging, labor and manufacturing costs can be saved by 5%.